PCB Fabrication Notes

1. The boards are to be sized as follows.  Pie Connector Board 4.100" X 1.750", Processor and I/O Boards 4.875" X 5.300" , Backplane Board 5.875" X 6.450"   all dimensions are +/- .005"


2. The stack up for the Processor Board, I/O board and the Backplane shall be:  
TOP
GND
INNER 1
INNER 2
PWR
BOT

3. The Rules for the Processor and I/O Boards are .005 X .005,  Backplane and Pie Connector Boards are .008 X .008.
4. Use FR-4
5. White Silk Screen
6. Solder Plate
7. 1.0 Oz copper
8. Electrical Testing
9. .062" +/- .006"
10.  LPI Solder mask RED