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Remaining life assessment of aging
electronics in avionic applications
Valentin,
R. Osterman, M. Newman, B.
CALCE Electron. Products & Syst.
Center, Maryland Univ., College Park, MD, USA;
This paper appears in: Reliability and
Maintainability Symposium, 2003. Annual
Publication Date: 2003
On page(s): 313- 318
ISSN: 0149-144X
Number of Pages: xviii+622
Abstract:
This paper describes an assessment of the
remaining life of solder interconnects for 13 different insertion
mount packages used in an engine control electronics. The assessment
consisted of using simulation to determine the mean time to failure
of solder joint interconnects between the package leads and printed
wiring boards under applied temperature cycle conditions. The
simulation results were confirmed by accelerated testing for a
132-pin grid array (PGA) and field data for a 40-lead side-brazed
dual in line package (DIP). Loading conditions include an
accelerated test condition of -45/spl deg/ to 100/spl deg/C and a
service loading condition of 10/spl deg/ to 75/spl deg/C with an
extended dwell at 60/spl deg/C. Predicted mean interconnect life
expectancy ranged from 4,000 in the worst case to 130,000 cycles.
Results indicate a brazed leaded ceramic dual inline package with 40
leads is likely to fail first and a 2 lead plastic encapsulated
axial capacitor is the least likely to fail. The early failure of
the 40-lead side-brazed DIP was confirmed by the service performance
data. The service life remaining after failure of the 40-lead
side-brazed DIP was estimated to be 7,800 cycles.
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