IEEE HomeSearch IEEE ShopWeb Account Contact IEEE IEEE
MembershipPublications/ServicesStandardsConferencesCareers/Jobs  
IEEE Xplore  
Help    FAQ   Terms   IEEE Peer Review
»Abstract  
Welcome to IEEE Xplore
Home
What Can I Access?
Log-out
Tables of Contents
Journals & Magazines
Conference Proceedings
Standards
K2 Search
By Author
Basic
Advanced
Member Services
Join IEEE


VIEW TOC    [PDF Full-Text (572 KB)]    PREV   NEXT   ABSTRACT PLUS   
You are not currently logged in. Guests may access abstract/citation records free of charge. Click here to log in.

You may purchase the PDF full-text document for up to three (3) downloads within 30 days.


A Bayes approach to step-stress accelerated life testing
Rene van Dorp, J.   Mazzuchi, T.A.   Fornell, G.E.   Pollock, L.R.  
George Washington Univ., Washington, DC;
This paper appears in: Reliability, IEEE Transactions on

Publication Date: Sep 1996
On page(s): 491-498
Volume: 45,   Issue: 3 
ISSN: 0018-9529
References Cited: 19
CODEN: IERQAD

Abstract:
This paper develops a Bayes model for step-stress accelerated life testing. The failure times at each stress level are exponentially distributed, but strict adherence to a time-transformation function is not required. Rather, prior information is used to define indirectly a multivariate prior distribution for the failure rates at the various stress levels. Our prior distribution preserves the natural ordering of the failure rates in both the prior and posterior estimates. Methods are developed for Bayes point estimates as well as for making probability statements for use-stress life parameters. The approach is illustrated with an example

VIEW TOC    [PDF Full-Text (572 KB)]    PREV   NEXT   ABSTRACT PLUS   

Home | Log-out | Journals | Conference Proceedings | Standards | Search by Author | Basic Search | Advanced Search Join IEEE | Web Account | New this week | OPAC Linking Information | Your Feedback | Technical Support | Email Alerting No Robots Please | Release Notes | IEEE Online Publications | Help | FAQ| Terms | Back to Top

Copyright © 2004 IEEE — All rights reserved