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A combined fuzzy-logic and
physics-of-failure approach to reliability
prediction
Bazu, M.
R&D Inst. for Electron. Components, Bucharest
;
This paper appears
in: Reliability, IEEE Transactions on
Publication Date: Jun 1995
On page(s): 237-242
Volume: 44, Issue:
2
ISSN:
0018-9529
References Cited:
16
CODEN: IERQAD
Abstract:
An original reliability prediction procedure is
presented. The physics of failure accounts for the failure
mechanisms involved (a lognormal distribution was presumed); the
interactions (synergies) between the technology factors depending on
the manufacturing techniques are considered. The basis of this
methodology (called SYRP=synergetic reliability prediction) is the
assessment of failure-risk coefficients (FRC), based on fuzzy logic,
for the potential failure mechanisms induced at each manufacturing
step. These FRC are corrected at the subsequent steps by considering
the synergy of the manufacturing factors, At the end of the
manufacturing process, final FRC are obtained for each potential
failure mechanism; the parameters of the lognormal distribution are
calculated with a simple algorithm. Experimental results for four
lots of the same type of semiconductor devices, each lot being
manufactured with a slightly different technology, were obtained.
SYRP forecasts for these four lots agree well with accelerated life
test results. This is a fairly good result, because SYRP was used
early, at the design phase
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