(footprint QFP50P700X700X120-32N (layer F.Cu) (tedit 663796E1)
  (descr "")
  (attr smd)
  (fp_text reference REF** (at -0.8266 -4.94457 0) (layer F.SilkS)
    (effects (font (size 1.00193700787 1.00193700787) (thickness 0.15)))
  )
  (fp_text value QFP50P700X700X120-32N (at 9.339765 4.967555 0) (layer F.Fab)
    (effects (font (size 1.00051181102 1.00051181102) (thickness 0.15)))
  )
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  (pad 12 smd roundrect (roundrect_rratio 0.03) (at -0.25 3.195 90.0) (size 1.44 0.26) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 13 smd roundrect (roundrect_rratio 0.03) (at 0.25 3.195 90.0) (size 1.44 0.26) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 14 smd roundrect (roundrect_rratio 0.03) (at 0.75 3.195 90.0) (size 1.44 0.26) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 15 smd roundrect (roundrect_rratio 0.03) (at 1.25 3.195 90.0) (size 1.44 0.26) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 16 smd roundrect (roundrect_rratio 0.03) (at 1.75 3.195 90.0) (size 1.44 0.26) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 17 smd roundrect (roundrect_rratio 0.03) (at 3.195 1.75 180.0) (size 1.44 0.26) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 18 smd roundrect (roundrect_rratio 0.03) (at 3.195 1.25 180.0) (size 1.44 0.26) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 19 smd roundrect (roundrect_rratio 0.03) (at 3.195 0.75 180.0) (size 1.44 0.26) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 20 smd roundrect (roundrect_rratio 0.03) (at 3.195 0.25 180.0) (size 1.44 0.26) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 21 smd roundrect (roundrect_rratio 0.03) (at 3.195 -0.25 180.0) (size 1.44 0.26) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 22 smd roundrect (roundrect_rratio 0.03) (at 3.195 -0.75 180.0) (size 1.44 0.26) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 23 smd roundrect (roundrect_rratio 0.03) (at 3.195 -1.25 180.0) (size 1.44 0.26) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 24 smd roundrect (roundrect_rratio 0.03) (at 3.195 -1.75 180.0) (size 1.44 0.26) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 25 smd roundrect (roundrect_rratio 0.03) (at 1.75 -3.195 270.0) (size 1.44 0.26) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 26 smd roundrect (roundrect_rratio 0.03) (at 1.25 -3.195 270.0) (size 1.44 0.26) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 27 smd roundrect (roundrect_rratio 0.03) (at 0.75 -3.195 270.0) (size 1.44 0.26) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 28 smd roundrect (roundrect_rratio 0.03) (at 0.25 -3.195 270.0) (size 1.44 0.26) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 29 smd roundrect (roundrect_rratio 0.03) (at -0.25 -3.195 270.0) (size 1.44 0.26) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 30 smd roundrect (roundrect_rratio 0.03) (at -0.75 -3.195 270.0) (size 1.44 0.26) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 31 smd roundrect (roundrect_rratio 0.03) (at -1.25 -3.195 270.0) (size 1.44 0.26) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 32 smd roundrect (roundrect_rratio 0.03) (at -1.75 -3.195 270.0) (size 1.44 0.26) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (fp_line (start -2.53 -2.53) (end 2.53 -2.53) (layer F.Fab) (width 0.127))
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)