(footprint IC_NX3L1G53GM_125 (layer F.Cu) (tedit 66817CF9)
  (descr "")
  (attr smd)
  (fp_text reference REF** (at 0.762 -1.6764 0) (layer F.SilkS))
  (fp_text value IC_NX3L1G53GM_125 (at 5.6388 1.4986 0) (layer F.Fab))
  (pad 1 smd rect (at -0.6 -0.55) (size 0.4 0.32) (layers F.Cu))
  (pad 2 smd rect (at -0.6 0.0) (size 0.4 0.22) (layers F.Cu))
  (pad 3 smd rect (at -0.6 0.5) (size 0.4 0.22) (layers F.Cu))
  (pad 6 smd rect (at 0.6 0.0) (size 0.4 0.22) (layers F.Cu))
  (pad 7 smd rect (at 0.6 -0.5) (size 0.4 0.22) (layers F.Cu))
  (pad 5 smd rect (at 0.6 0.5) (size 0.4 0.22) (layers F.Cu))
  (pad 4 smd rect (at 0.0 0.6) (size 0.22 0.4) (layers F.Cu))
  (pad 8 smd rect (at 0.0 -0.6) (size 0.22 0.4) (layers F.Cu))
  (zone (net 0) (net_name "") (layer F.Cu) (hatch full 0.508)
    (connect_pads (clearance 0))
    (min_thickness 0.01)
    (keepout (tracks not_allowed) (vias not_allowed) (pads not_allowed ) (copperpour not_allowed) (footprints allowed))
    (fill (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy -0.325 -0.325)
        (xy 0.325 -0.325)
        (xy 0.325 0.325)
        (xy -0.325 0.325)
      )
    )
  )
  (zone (net 0) (net_name "") (layers *.Cu) (hatch full 0.508)
    (connect_pads (clearance 0))
    (min_thickness 0.01)
    (keepout (tracks allowed) (vias not_allowed) (pads allowed ) (copperpour allowed) (footprints allowed))
    (fill (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy -0.325 -0.325)
        (xy 0.325 -0.325)
        (xy 0.325 0.325)
        (xy -0.325 0.325)
      )
    )
  )
)