(footprint CONV_PEP1-S5-D9-M (layer F.Cu) (tedit 662ADE98)
  (descr "")
  (attr smd)
  (fp_text reference REF** (at -3.015 -8.805 0) (layer F.SilkS))
  (fp_text value CONV_PEP1-S5-D9-M (at 4.605 9.075 0) (layer F.Fab))
  (pad 1 smd roundrect (roundrect_rratio 0.13) (at -5.05 -6.35) (size 2.1 1.0) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 2 smd roundrect (roundrect_rratio 0.13) (at -5.05 -3.81) (size 2.1 1.0) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 3 smd roundrect (roundrect_rratio 0.13) (at -5.05 -1.27) (size 2.1 1.0) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 5 smd roundrect (roundrect_rratio 0.13) (at -5.05 3.81) (size 2.1 1.0) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 6 smd roundrect (roundrect_rratio 0.13) (at -5.05 6.35) (size 2.1 1.0) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 7 smd roundrect (roundrect_rratio 0.13) (at 5.05 6.35) (size 2.1 1.0) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 8 smd roundrect (roundrect_rratio 0.13) (at 5.05 3.81) (size 2.1 1.0) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 10 smd roundrect (roundrect_rratio 0.13) (at 5.05 -1.27) (size 2.1 1.0) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 11 smd roundrect (roundrect_rratio 0.13) (at 5.05 -3.81) (size 2.1 1.0) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 12 smd roundrect (roundrect_rratio 0.13) (at 5.05 -6.35) (size 2.1 1.0) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
)