(module Cree_XP-L_HI-vias-4 (layer F.Cu) (tedit 58E2DD74)
  (attr smd)
  (fp_text reference D71 (at 3.042324 0.3238 90) (layer F.SilkS))
  (fp_text value Cree_XP-L_HI (at 0.0508 -3.8862) (layer F.Fab))
  (pad 3 smd rect (at 0 0) (size 1.3 3.81) (layers F.Cu F.Paste F.Mask))
  (pad 2 smd rect (at 1.6 0) (size 0.9 3.81) (layers F.Cu F.Paste F.Mask))
  (pad 1 smd rect (at -1.6 0) (size 0.9 3.81) (layers F.Cu F.Paste F.Mask))
  (pad 2 thru_hole circle (at 1.5875 -0.8255) (size 0.7366 0.7366) (drill 0.381) (layers *.Cu *.Mask F.SilkS))
  (pad 2 thru_hole circle (at 1.5875 0.762) (size 0.7366 0.7366) (drill 0.381) (layers *.Cu *.Mask F.SilkS))
  (pad 3 thru_hole circle (at 0 -0.8255) (size 0.7366 0.7366) (drill 0.381) (layers *.Cu *.Mask F.SilkS))
  (pad 3 thru_hole circle (at 0 0.762) (size 0.7366 0.7366) (drill 0.381) (layers *.Cu *.Mask F.SilkS))
  (pad 1 thru_hole circle (at -1.5875 -0.8255) (size 0.7366 0.7366) (drill 0.381) (layers *.Cu *.Mask F.SilkS))
  (pad 1 thru_hole circle (at -1.5875 0.762) (size 0.7366 0.7366) (drill 0.381) (layers *.Cu *.Mask F.SilkS))
)
