(footprint SOIC127P600X175-8N (layer F.Cu) (tedit 657F3CAB)
  (descr "")
  (attr smd)
  (fp_text reference REF** (at -0.795 -3.332 0) (layer F.SilkS))
  (fp_text value SOIC127P600X175-8N (at 7.46 3.332 0) (layer F.Fab))
  (pad 1 smd roundrect (roundrect_rratio 0.07) (at -2.475 -1.905) (size 1.97 0.59) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 2 smd roundrect (roundrect_rratio 0.07) (at -2.475 -0.635) (size 1.97 0.59) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 3 smd roundrect (roundrect_rratio 0.07) (at -2.475 0.635) (size 1.97 0.59) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 4 smd roundrect (roundrect_rratio 0.07) (at -2.475 1.905) (size 1.97 0.59) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 5 smd roundrect (roundrect_rratio 0.07) (at 2.475 1.905) (size 1.97 0.59) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 6 smd roundrect (roundrect_rratio 0.07) (at 2.475 0.635) (size 1.97 0.59) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 7 smd roundrect (roundrect_rratio 0.07) (at 2.475 -0.635) (size 1.97 0.59) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 8 smd roundrect (roundrect_rratio 0.07) (at 2.475 -1.905) (size 1.97 0.59) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
)