(module IND_ETQP8M2R5JFA (layer F.Cu) (tedit 62F5AA05)
  (descr "")
  (fp_text reference REF** (at -8.255 -10.795 0) (layer F.SilkS))
  (fp_text value IND_ETQP8M2R5JFA (at -1.27 10.795 0) (layer F.Fab))
  (pad 1 smd rect (at -6.0 0.0) (size 10.0 20.0) (layers F.Cu))
  (pad 2 smd rect (at 6.0 0.0) (size 10.0 20.0) (layers F.Cu))
  (zone (net 0) (net_name "") (layer F.Cu) (hatch full 0.508)
    (connect_pads (clearance 0))
    (min_thickness 0.01)
    (keepout (tracks not_allowed) (vias not_allowed) (pads not_allowed ) (copperpour not_allowed) (footprints allowed))
    (fill (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy -1.0 -10.0)
        (xy 1.0 -10.0)
        (xy 1.0 10.0)
        (xy -1.0 10.0)
      )
    )
  )
  (zone (net 0) (net_name "") (layers *.Cu) (hatch full 0.508)
    (connect_pads (clearance 0))
    (min_thickness 0.01)
    (keepout (tracks allowed) (vias not_allowed) (pads allowed ) (copperpour allowed) (footprints allowed))
    (fill (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy -1.0 -10.0)
        (xy 1.0 -10.0)
        (xy 1.0 10.0)
        (xy -1.0 10.0)
      )
    )
  )
)