(footprint "PowerPAK 1212" (version 20211014) (generator pcbnew)
  (layer "F.Cu")
  (tedit 5BE0811B)
  (attr through_hole)
  (fp_text reference "REF**" (at 0 3.3) (layer "F.SilkS"))
  (fp_text value "PowerPAK 1212" (at 0.1 -3.7) (layer "F.Fab"))
  (pad "1" smd rect (at -1.435 -0.99) (size 0.99 0.405) (layers "F.Cu" "F.Paste" "F.Mask"))
  (pad "2" smd rect (at -1.435 -0.33) (size 0.99 0.405) (layers "F.Cu" "F.Paste" "F.Mask"))
  (pad "3" smd rect (at -1.435 0.33) (size 0.99 0.405) (layers "F.Cu" "F.Paste" "F.Mask"))
  (pad "4" smd rect (at -1.435 0.99) (size 0.99 0.405) (layers "F.Cu" "F.Paste" "F.Mask"))
  (pad "5" smd rect (at 0.56388 0) (size 1.725 2.235) (layers "F.Cu" "F.Paste" "F.Mask"))
  (pad "5" smd rect (at 1.55 -0.99) (size 0.76 0.405) (layers "F.Cu" "F.Paste" "F.Mask"))
  (pad "5" smd rect (at 1.55 -0.33) (size 0.76 0.405) (layers "F.Cu" "F.Paste" "F.Mask"))
  (pad "5" smd rect (at 1.55 0.33) (size 0.76 0.405) (layers "F.Cu" "F.Paste" "F.Mask"))
  (pad "5" smd rect (at 1.55 0.99) (size 0.76 0.405) (layers "F.Cu" "F.Paste" "F.Mask"))
)
