(footprint SOT95P237X112-3N (layer F.Cu) (tedit 6625B9EB)
  (descr "")
  (attr smd)
  (fp_text reference REF** (at 0.107 -2.3864 0) (layer F.SilkS))
  (fp_text value SOT95P237X112-3N (at 4.5774 2.3864 0) (layer F.Fab))
  (pad 1 smd roundrect (roundrect_rratio 0.08) (at -1.065 -0.95) (size 1.22 0.62) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 2 smd roundrect (roundrect_rratio 0.08) (at -1.065 0.95) (size 1.22 0.62) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 3 smd roundrect (roundrect_rratio 0.08) (at 1.065 0.0) (size 1.22 0.62) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
)