(kicad_pcb (version 20221018) (generator pcbnew)
  (general
    (thickness 1.6)
  )
  (paper "USLetter")
  (title_block
    (title "Roadrunner-TM4C123G")
    (date "2017-07-12")
    (rev "v1.1")
    (company "Jacob Miller")
  )
  (layers
    (0 "F.Cu" signal "Top")
    (1 "In1.Cu" signal "Ground")
    (2 "In2.Cu" mixed "Power")
    (31 "B.Cu" signal "Bottom")
    (32 "B.Adhes" user "B.Adhesive")
    (33 "F.Adhes" user "F.Adhesive")
    (34 "B.Paste" user)
    (35 "F.Paste" user)
    (36 "B.SilkS" user "B.Silkscreen")
    (37 "F.SilkS" user "F.Silkscreen")
    (38 "B.Mask" user)
    (39 "F.Mask" user)
    (40 "Dwgs.User" user "User.Drawings")
    (41 "Cmts.User" user "User.Comments")
    (42 "Eco1.User" user "User.Eco1")
    (43 "Eco2.User" user "User.Eco2")
    (44 "Edge.Cuts" user)
    (45 "Margin" user)
    (46 "B.CrtYd" user "B.Courtyard")
    (47 "F.CrtYd" user "F.Courtyard")
    (48 "B.Fab" user)
    (49 "F.Fab" user)
  )
  (setup
    (pad_to_mask_clearance 0.2)
    (aux_axis_origin 110.998 125.095)
    (pcbplotparams
      (layerselection 0x00010fc_80000007)
      (plot_on_all_layers_selection 0x0000000_00000000)
      (disableapertmacros false)
      (usegerberextensions false)
      (usegerberattributes true)
      (usegerberadvancedattributes true)
      (creategerberjobfile true)
      (dashed_line_dash_ratio 12.000000)
      (dashed_line_gap_ratio 3.000000)
      (svgprecision 6)
      (plotframeref false)
      (viasonmask false)
      (mode 1)
      (useauxorigin false)
      (hpglpennumber 1)
      (hpglpenspeed 20)
      (hpglpendiameter 15.000000)
      (dxfpolygonmode true)
      (dxfimperialunits true)
      (dxfusepcbnewfont true)
      (psnegative false)
      (psa4output false)
      (plotreference true)
      (plotvalue true)
      (plotinvisibletext false)
      (sketchpadsonfab false)
      (subtractmaskfromsilk false)
      (outputformat 1)
      (mirror false)
      (drillshape 0)
      (scaleselection 1)
      (outputdirectory "Gerber")
    )
  )
  (net 0 "")
  (net 1 "/XOSC_GND")
  (net 2 "GNDREF")
  (net 3 "+3V3")
  (net 4 "/~{HIB}")
  (net 5 "+5V")
  (net 6 "/A0")
  (net 7 "/A1")
  (net 8 "/A2")
  (net 9 "/A3")
  (net 10 "/A4(SDA)")
  (net 11 "/A5(SCL)")
  (net 12 "/~{WAKE}")
  (net 13 "/USB_D_N")
  (net 14 "/USB_D_P")
  (net 15 "/DEBUG_TCK")
  (net 16 "/DEBUG_TMS")
  (net 17 "/DEBUG_TDI")
  (net 18 "/DEBUG_TDO")
  (net 19 "/13(SCK)")
  (net 20 "/12(MISO)")
  (net 21 "/+AREF")
  (net 22 "/-AREF")
  (net 23 "/D9")
  (net 24 "/D8")
  (net 25 "/D7")
  (net 26 "/D6")
  (net 27 "/D5")
  (net 28 "/D4")
  (net 29 "/D3")
  (net 30 "/D2")
  (net 31 "/PF4")
  (net 32 "/PB6(MISO)")
  (net 33 "/PB7(MOSI)")
  (net 34 "/PC4(U4RX)")
  (net 35 "/PC5(U4TX)")
  (net 36 "/PC6(U3RX)")
  (net 37 "/PC7(U3TX)")
  (net 38 "/PD6(U2RX)")
  (net 39 "/PD7(U2TX)")
  (net 40 "/PA2")
  (net 41 "/PA3")
  (net 42 "/PA4")
  (net 43 "/PA5")
  (net 44 "/PB0(U1RX)")
  (net 45 "/PB1(U1TX)")
  (net 46 "/USB_ID")
  (net 47 "/11(MOSI)")
  (net 48 "/10(SS)")
  (net 49 "/VDDC")
  (net 50 "/D1(TX)")
  (net 51 "/D0(RX)")
  (net 52 "/PWR_LED")
  (net 53 "/TX_LED")
  (net 54 "/RX_LED")
  (net 55 "/~{RST}")
  (net 56 "/Q1D2")
  (net 57 "/Q1D1")
  (net 58 "/Q1G1")
  (net 59 "/Q1G2")
  (net 60 "/Q2D1")
  (net 61 "/PB6_LED")
  (net 62 "/Q2D2")
  (net 63 "/Q2G1")
  (net 64 "/Q2G2")
  (net 65 "/VIn")
  (net 66 "/XOSC0")
  (net 67 "/XOSC1")
  (net 68 "/OCS0")
  (net 69 "/OCS1")
  (footprint "Pin_Headers:Pin_Header_Straight_1x01_Pitch2.54mm" (layer "F.Cu")
    (at 127 99.06 -90)
    (descr "Through hole straight pin header, 1x01, 2.54mm pitch, single row")
    (tags "Through hole pin header THT 1x01 2.54mm single row")
    (attr through_hole)
    (fp_text reference "J3" (at 0.127 0) (layer "F.Fab") hide)
    (fp_text value "~{RST}" (at 2.159 0) (layer "F.SilkS"))
    (fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab") hide)
    (pad "1" thru_hole rect (at 0 0 270) (size 1.7 1.7) (drill 1) (layers "*.Cu" "*.Mask")
      (net 55 "/~{RST}"))
    (model "${KISYS3DMOD}/Pin_Headers.3dshapes/Pin_Header_Straight_1x01_Pitch2.54mm.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 90))
    )
  )
  (footprint "Housings_QFP:LQFP-64_10x10mm_Pitch0.5mm" (layer "F.Cu")
    (at 144.78 99.695 90)
    (descr "64 LEAD LQFP 10x10mm (see MICREL LQFP10x10-64LD-PL-1.pdf)")
    (tags "QFP 0.5")
    (attr smd)
    (fp_text reference "U1" (at 6.096 -5.715 180) (layer "F.SilkS"))
    (fp_text value "TM4C123GH6PM" (at 0 7.2 90) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab"))
    (pad "1" smd rect (at -5.7 -3.75 90) (size 1 0.25) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 32 "/PB6(MISO)"))
    (pad "2" smd rect (at -5.7 -3.25 90) (size 1 0.25) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 21 "/+AREF"))
    (pad "3" smd rect (at -5.7 -2.75 90) (size 1 0.25) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 22 "/-AREF"))
    (pad "4" smd rect (at -5.7 -2.25 90) (size 1 0.25) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 33 "/PB7(MOSI)"))
    (pad "5" smd rect (at -5.7 -1.75 90) (size 1 0.25) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 31 "/PF4"))
    (pad "6" smd rect (at -5.7 -1.25 90) (size 1 0.25) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 6 "/A0"))
    (pad "7" smd rect (at -5.7 -0.75 90) (size 1 0.25) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 7 "/A1"))
    (pad "8" smd rect (at -5.7 -0.25 90) (size 1 0.25) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 8 "/A2"))
    (pad "9" smd rect (at -5.7 0.25 90) (size 1 0.25) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 9 "/A3"))
    (pad "10" smd rect (at -5.8 0.75 90) (size 1.2 0.25) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 39 "/PD7(U2TX)"))
    (pad "11" smd rect (at -5.7 1.25 90) (size 1 0.25) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 3 "+3V3"))
    (pad "12" smd rect (at -5.7 1.75 90) (size 1 0.25) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "GNDREF"))
    (pad "13" smd rect (at -5.7 2.25 90) (size 1 0.25) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 37 "/PC7(U3TX)"))
    (pad "14" smd rect (at -5.7 2.75 90) (size 1 0.25) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 36 "/PC6(U3RX)"))
    (pad "15" smd rect (at -5.7 3.25 90) (size 1 0.25) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 35 "/PC5(U4TX)"))
    (pad "16" smd rect (at -5.7 3.75 90) (size 1 0.25) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 34 "/PC4(U4RX)"))
    (pad "17" smd rect (at -3.75 5.7 180) (size 1 0.25) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 51 "/D0(RX)"))
    (pad "18" smd rect (at -3.25 5.7 180) (size 1 0.25) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 50 "/D1(TX)"))
    (pad "19" smd rect (at -2.75 5.7 180) (size 1 0.25) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 40 "/PA2"))
    (pad "20" smd rect (at -2.25 5.7 180) (size 1 0.25) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 41 "/PA3"))
    (pad "21" smd rect (at -1.75 5.7 180) (size 1 0.25) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 42 "/PA4"))
    (pad "22" smd rect (at -1.25 5.7 180) (size 1 0.25) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 43 "/PA5"))
    (pad "23" smd rect (at -0.75 5.8 180) (size 1.2 0.25) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 29 "/D3"))
    (pad "24" smd rect (at -0.25 5.8 180) (size 1.2 0.25) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 30 "/D2"))
    (pad "25" smd rect (at 0.25 5.7 180) (size 1 0.25) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 49 "/VDDC"))
    (pad "26" smd rect (at 0.75 5.7 180) (size 1 0.25) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 3 "+3V3"))
    (pad "27" smd rect (at 1.25 5.7 180) (size 1 0.25) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "GNDREF"))
    (pad "28" smd rect (at 1.75 5.7 180) (size 1 0.25) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 20 "/12(MISO)"))
    (pad "29" smd rect (at 2.25 5.7 180) (size 1 0.25) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 47 "/11(MOSI)"))
    (pad "30" smd rect (at 2.75 5.7 180) (size 1 0.25) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 19 "/13(SCK)"))
    (pad "31" smd rect (at 3.25 5.7 180) (size 1 0.25) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 48 "/10(SS)"))
    (pad "32" smd rect (at 3.75 5.7 180) (size 1 0.25) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 12 "/~{WAKE}"))
    (pad "33" smd rect (at 5.7 3.75 90) (size 1 0.25) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 4 "/~{HIB}"))
    (pad "34" smd rect (at 5.7 3.25 90) (size 1 0.25) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 66 "/XOSC0"))
    (pad "35" smd rect (at 5.7 2.75 90) (size 1 0.25) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 1 "/XOSC_GND"))
    (pad "36" smd rect (at 5.7 2.25 90) (size 1 0.25) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 67 "/XOSC1"))
    (pad "37" smd rect (at 5.7 1.75 90) (size 1 0.25) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 3 "+3V3"))
    (pad "38" smd rect (at 5.8 1.25 90) (size 1.2 0.25) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 55 "/~{RST}"))
    (pad "39" smd rect (at 5.7 0.75 90) (size 1 0.25) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "GNDREF"))
    (pad "40" smd rect (at 5.7 0.25 90) (size 1 0.25) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 68 "/OCS0"))
    (pad "41" smd rect (at 5.7 -0.25 90) (size 1 0.25) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 69 "/OCS1"))
    (pad "42" smd rect (at 5.8 -0.75 90) (size 1.2 0.25) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 3 "+3V3"))
    (pad "43" smd rect (at 5.7 -1.25 90) (size 1 0.25) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 13 "/USB_D_N"))
    (pad "44" smd rect (at 5.7 -1.75 90) (size 1 0.25) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 14 "/USB_D_P"))
    (pad "45" smd rect (at 5.8 -2.25 90) (size 1.2 0.25) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 44 "/PB0(U1RX)"))
    (pad "46" smd rect (at 5.8 -2.75 90) (size 1.2 0.25) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 45 "/PB1(U1TX)"))
    (pad "47" smd rect (at 5.7 -3.25 90) (size 1 0.25) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 11 "/A5(SCL)"))
    (pad "48" smd rect (at 5.7 -3.75 90) (size 1 0.25) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 10 "/A4(SDA)"))
    (pad "49" smd rect (at 3.75 -5.7 180) (size 1 0.25) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 18 "/DEBUG_TDO"))
    (pad "50" smd rect (at 3.25 -5.7 180) (size 1 0.25) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 17 "/DEBUG_TDI"))
    (pad "51" smd rect (at 2.75 -5.7 180) (size 1 0.25) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 16 "/DEBUG_TMS"))
    (pad "52" smd rect (at 2.25 -5.7 180) (size 1 0.25) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 15 "/DEBUG_TCK"))
    (pad "53" smd rect (at 1.75 -5.8 180) (size 1.2 0.25) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 38 "/PD6(U2RX)"))
    (pad "54" smd rect (at 1.25 -5.7 180) (size 1 0.25) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 3 "+3V3"))
    (pad "55" smd rect (at 0.75 -5.7 180) (size 1 0.25) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "GNDREF"))
    (pad "56" smd rect (at 0.25 -5.7 180) (size 1 0.25) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 49 "/VDDC"))
    (pad "57" smd rect (at -0.25 -5.8 180) (size 1.2 0.25) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 25 "/D7"))
    (pad "58" smd rect (at -0.75 -5.8 180) (size 1.2 0.25) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 26 "/D6"))
    (pad "59" smd rect (at -1.25 -5.8 180) (size 1.2 0.25) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 28 "/D4"))
    (pad "60" smd rect (at -1.75 -5.8 180) (size 1.2 0.25) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 27 "/D5"))
    (pad "61" smd rect (at -2.25 -5.7 180) (size 1 0.25) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 23 "/D9"))
    (pad "62" smd rect (at -2.75 -5.7 180) (size 1 0.25) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 24 "/D8"))
    (pad "63" smd rect (at -3.25 -5.7 180) (size 1 0.25) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 11 "/A5(SCL)"))
    (pad "64" smd rect (at -3.75 -5.7 180) (size 1 0.25) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 10 "/A4(SDA)"))
    (model "Housings_QFP.3dshapes/LQFP-64_10x10mm_Pitch0.5mm.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Crystals:Crystal_SMD_5032-2pin_5.0x3.2mm_HandSoldering" (layer "F.Cu")
    (at 142.113 84.455 180)
    (descr "SMD Crystal SERIES SMD2520/2 http://www.icbase.com/File/PDF/HKC/HKC00061008.pdf, hand-soldering, 5.0x3.2mm^2 package")
    (tags "SMD SMT crystal hand-soldering")
    (attr smd)
    (fp_text reference "Y2" (at 5.461 0) (layer "F.SilkS"))
    (fp_text value "16MHz" (at -6.477 0) (layer "F.SilkS"))
    (fp_text user "${REFERENCE}" (at 5.461 0 180) (layer "F.Fab"))
    (pad "1" smd rect (at -2.6 0 180) (size 3.5 2.4) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 68 "/OCS0"))
    (pad "2" smd rect (at 2.6 0 180) (size 3.5 2.4) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 69 "/OCS1"))
    (model "${KISYS3DMOD}/Crystals.3dshapes/Crystal_SMD_5032-2pin_5.0x3.2mm_HandSoldering.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 0.393701 0.393701 0.393701))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Socket_Strips:Socket_Strip_Straight_1x08_Pitch2.54mm" locked (layer "F.Cu")
    (at 138.938 123.825 90)
    (descr "Through hole straight socket strip, 1x08, 2.54mm pitch, single row")
    (tags "Through hole socket strip THT 1x08 2.54mm single row")
    (attr through_hole)
    (fp_text reference "J7" (at 0 -2.33 90) (layer "F.SilkS") hide)
    (fp_text value "Power" (at 0 20.11 90) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 -2.33 90) (layer "F.Fab") hide)
    (pad "1" thru_hole rect locked (at 0 0 90) (size 1.7 1.7) (drill 1) (layers "*.Cu" "*.Mask"))
    (pad "2" thru_hole oval locked (at 0 2.54 90) (size 1.7 1.7) (drill 1) (layers "*.Cu" "*.Mask")
      (net 3 "+3V3"))
    (pad "3" thru_hole oval locked (at 0 5.08 90) (size 1.7 1.7) (drill 1) (layers "*.Cu" "*.Mask")
      (net 55 "/~{RST}"))
    (pad "4" thru_hole oval locked (at 0 7.62 90) (size 1.7 1.7) (drill 1) (layers "*.Cu" "*.Mask")
      (net 3 "+3V3"))
    (pad "5" thru_hole oval locked (at 0 10.16 90) (size 1.7 1.7) (drill 1) (layers "*.Cu" "*.Mask")
      (net 5 "+5V"))
    (pad "6" thru_hole oval locked (at 0 12.7 90) (size 1.7 1.7) (drill 1) (layers "*.Cu" "*.Mask")
      (net 2 "GNDREF"))
    (pad "7" thru_hole oval locked (at 0 15.24 90) (size 1.7 1.7) (drill 1) (layers "*.Cu" "*.Mask")
      (net 2 "GNDREF"))
    (pad "8" thru_hole oval locked (at 0 17.78 90) (size 1.7 1.7) (drill 1) (layers "*.Cu" "*.Mask")
      (net 65 "/VIn"))
    (model "${KISYS3DMOD}/Socket_Strips.3dshapes/Socket_Strip_Straight_1x08_Pitch2.54mm.wrl"
      (offset (xyz 0 -8.889999866 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 270))
    )
  )
  (footprint "Socket_Strips:Socket_Strip_Straight_1x06_Pitch2.54mm" locked (layer "F.Cu")
    (at 161.798 123.825 90)
    (descr "Through hole straight socket strip, 1x06, 2.54mm pitch, single row")
    (tags "Through hole socket strip THT 1x06 2.54mm single row")
    (attr through_hole)
    (fp_text reference "J8" (at 0 -2.33 90) (layer "F.SilkS") hide)
    (fp_text value "Analog" (at 0 15.03 90) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 -2.33 90) (layer "F.Fab") hide)
    (pad "1" thru_hole rect locked (at 0 0 90) (size 1.7 1.7) (drill 1) (layers "*.Cu" "*.Mask")
      (net 6 "/A0"))
    (pad "2" thru_hole oval locked (at 0 2.54 90) (size 1.7 1.7) (drill 1) (layers "*.Cu" "*.Mask")
      (net 7 "/A1"))
    (pad "3" thru_hole oval locked (at 0 5.08 90) (size 1.7 1.7) (drill 1) (layers "*.Cu" "*.Mask")
      (net 8 "/A2"))
    (pad "4" thru_hole oval locked (at 0 7.62 90) (size 1.7 1.7) (drill 1) (layers "*.Cu" "*.Mask")
      (net 9 "/A3"))
    (pad "5" thru_hole oval locked (at 0 10.16 90) (size 1.7 1.7) (drill 1) (layers "*.Cu" "*.Mask")
      (net 10 "/A4(SDA)"))
    (pad "6" thru_hole oval locked (at 0 12.7 90) (size 1.7 1.7) (drill 1) (layers "*.Cu" "*.Mask")
      (net 11 "/A5(SCL)"))
    (model "${KISYS3DMOD}/Socket_Strips.3dshapes/Socket_Strip_Straight_1x06_Pitch2.54mm.wrl"
      (offset (xyz 0 -6.349999905 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 270))
    )
  )
  (footprint "Socket_Strips:Socket_Strip_Straight_1x10_Pitch2.54mm" locked (layer "F.Cu")
    (at 129.794 75.565 90)
    (descr "Through hole straight socket strip, 1x10, 2.54mm pitch, single row")
    (tags "Through hole socket strip THT 1x10 2.54mm single row")
    (attr through_hole)
    (fp_text reference "J9" (at 0 -2.33 90) (layer "F.SilkS") hide)
    (fp_text value "Digital" (at 0 25.19 90) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 -2.33 90) (layer "F.Fab") hide)
    (pad "1" thru_hole rect locked (at 0 0 90) (size 1.7 1.7) (drill 1) (layers "*.Cu" "*.Mask")
      (net 11 "/A5(SCL)"))
    (pad "2" thru_hole oval locked (at 0 2.54 90) (size 1.7 1.7) (drill 1) (layers "*.Cu" "*.Mask")
      (net 10 "/A4(SDA)"))
    (pad "3" thru_hole oval locked (at 0 5.08 90) (size 1.7 1.7) (drill 1) (layers "*.Cu" "*.Mask")
      (net 21 "/+AREF"))
    (pad "4" thru_hole oval locked (at 0 7.62 90) (size 1.7 1.7) (drill 1) (layers "*.Cu" "*.Mask")
      (net 2 "GNDREF"))
    (pad "5" thru_hole oval locked (at 0 10.16 90) (size 1.7 1.7) (drill 1) (layers "*.Cu" "*.Mask")
      (net 19 "/13(SCK)"))
    (pad "6" thru_hole oval locked (at 0 12.7 90) (size 1.7 1.7) (drill 1) (layers "*.Cu" "*.Mask")
      (net 20 "/12(MISO)"))
    (pad "7" thru_hole oval locked (at 0 15.24 90) (size 1.7 1.7) (drill 1) (layers "*.Cu" "*.Mask")
      (net 47 "/11(MOSI)"))
    (pad "8" thru_hole oval locked (at 0 17.78 90) (size 1.7 1.7) (drill 1) (layers "*.Cu" "*.Mask")
      (net 48 "/10(SS)"))
    (pad "9" thru_hole oval locked (at 0 20.32 90) (size 1.7 1.7) (drill 1) (layers "*.Cu" "*.Mask")
      (net 23 "/D9"))
    (pad "10" thru_hole oval locked (at 0 22.86 90) (size 1.7 1.7) (drill 1) (layers "*.Cu" "*.Mask")
      (net 24 "/D8"))
    (model "${KISYS3DMOD}/Socket_Strips.3dshapes/Socket_Strip_Straight_1x10_Pitch2.54mm.wrl"
      (offset (xyz 0 -11.42999983 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 270))
    )
  )
  (footprint "Socket_Strips:Socket_Strip_Straight_1x08_Pitch2.54mm" locked (layer "F.Cu")
    (at 156.718 75.565 90)
    (descr "Through hole straight socket strip, 1x08, 2.54mm pitch, single row")
    (tags "Through hole socket strip THT 1x08 2.54mm single row")
    (attr through_hole)
    (fp_text reference "J10" (at 0 -2.33 90) (layer "F.SilkS") hide)
    (fp_text value "Digital" (at 0 20.11 90) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 -2.33 90) (layer "F.Fab") hide)
    (pad "1" thru_hole rect locked (at 0 0 90) (size 1.7 1.7) (drill 1) (layers "*.Cu" "*.Mask")
      (net 25 "/D7"))
    (pad "2" thru_hole oval locked (at 0 2.54 90) (size 1.7 1.7) (drill 1) (layers "*.Cu" "*.Mask")
      (net 26 "/D6"))
    (pad "3" thru_hole oval locked (at 0 5.08 90) (size 1.7 1.7) (drill 1) (layers "*.Cu" "*.Mask")
      (net 27 "/D5"))
    (pad "4" thru_hole oval locked (at 0 7.62 90) (size 1.7 1.7) (drill 1) (layers "*.Cu" "*.Mask")
      (net 28 "/D4"))
    (pad "5" thru_hole oval locked (at 0 10.16 90) (size 1.7 1.7) (drill 1) (layers "*.Cu" "*.Mask")
      (net 29 "/D3"))
    (pad "6" thru_hole oval locked (at 0 12.7 90) (size 1.7 1.7) (drill 1) (layers "*.Cu" "*.Mask")
      (net 30 "/D2"))
    (pad "7" thru_hole oval locked (at 0 15.24 90) (size 1.7 1.7) (drill 1) (layers "*.Cu" "*.Mask")
      (net 50 "/D1(TX)"))
    (pad "8" thru_hole oval locked (at 0 17.78 90) (size 1.7 1.7) (drill 1) (layers "*.Cu" "*.Mask")
      (net 51 "/D0(RX)"))
    (model "${KISYS3DMOD}/Socket_Strips.3dshapes/Socket_Strip_Straight_1x08_Pitch2.54mm.wrl"
      (offset (xyz 0 -8.889999866 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 270))
    )
  )
  (footprint "Socket_Strips:Socket_Strip_Straight_1x01_Pitch2.54mm" (layer "F.Cu")
    (at 171.958 95.885)
    (descr "Through hole straight socket strip, 1x01, 2.54mm pitch, single row")
    (tags "Through hole socket strip THT 1x01 2.54mm single row")
    (attr through_hole)
    (fp_text reference "J4" (at 0 0) (layer "F.SilkS") hide)
    (fp_text value "PF4" (at 0 0) (layer "F.SilkS") hide)
    (fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab") hide)
    (pad "1" thru_hole rect (at 0 0) (size 1.7 1.7) (drill 1) (layers "*.Cu" "*.Mask")
      (net 31 "/PF4"))
    (model "${KISYS3DMOD}/Socket_Strips.3dshapes/Socket_Strip_Straight_1x01_Pitch2.54mm.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 270))
    )
  )
  (footprint "Socket_Strips:Socket_Strip_Straight_1x02_Pitch2.54mm" (layer "F.Cu")
    (at 171.958 113.665 90)
    (descr "Through hole straight socket strip, 1x02, 2.54mm pitch, single row")
    (tags "Through hole socket strip THT 1x02 2.54mm single row")
    (attr through_hole)
    (fp_text reference "J17" (at 0 0.127 180) (layer "F.SilkS") hide)
    (fp_text value "SPI 2 (D22,D23)" (at 0 1.27 180) (layer "F.SilkS") hide)
    (fp_text user "${REFERENCE}" (at 0 0 180) (layer "F.Fab") hide)
    (pad "1" thru_hole rect (at 0 0 90) (size 1.7 1.7) (drill 1) (layers "*.Cu" "*.Mask")
      (net 32 "/PB6(MISO)"))
    (pad "2" thru_hole oval (at 0 2.54 90) (size 1.7 1.7) (drill 1) (layers "*.Cu" "*.Mask")
      (net 33 "/PB7(MOSI)"))
    (model "${KISYS3DMOD}/Socket_Strips.3dshapes/Socket_Strip_Straight_1x02_Pitch2.54mm.wrl"
      (offset (xyz 0 -1.269999981 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 270))
    )
  )
  (footprint "Socket_Strips:Socket_Strip_Straight_1x02_Pitch2.54mm" (layer "F.Cu")
    (at 171.958 106.045 90)
    (descr "Through hole straight socket strip, 1x02, 2.54mm pitch, single row")
    (tags "Through hole socket strip THT 1x02 2.54mm single row")
    (attr through_hole)
    (fp_text reference "J19" (at 0 1.27 180) (layer "Eco1.User") hide)
    (fp_text value "SERIAL 2" (at 0 1.27 180) (layer "F.SilkS") hide)
    (fp_text user "RX2" (at 0 1.27 180) (layer "F.SilkS") hide)
    (pad "1" thru_hole rect (at 0 0 90) (size 1.7 1.7) (drill 1) (layers "*.Cu" "*.Mask")
      (net 38 "/PD6(U2RX)"))
    (pad "2" thru_hole oval (at 0 2.54 90) (size 1.7 1.7) (drill 1) (layers "*.Cu" "*.Mask")
      (net 39 "/PD7(U2TX)"))
    (model "${KISYS3DMOD}/Socket_Strips.3dshapes/Socket_Strip_Straight_1x02_Pitch2.54mm.wrl"
      (offset (xyz 0 -1.269999981 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 270))
    )
  )
  (footprint "Socket_Strips:Socket_Strip_Straight_1x02_Pitch2.54mm" (layer "F.Cu")
    (at 171.958 103.505 90)
    (descr "Through hole straight socket strip, 1x02, 2.54mm pitch, single row")
    (tags "Through hole socket strip THT 1x02 2.54mm single row")
    (attr through_hole)
    (fp_text reference "J21" (at 0 1.27 180) (layer "Eco1.User") hide)
    (fp_text value "SERIAL 1" (at 0 1.27 180) (layer "F.SilkS") hide)
    (fp_text user "RX1" (at 0 1.27 180) (layer "F.SilkS") hide)
    (pad "1" thru_hole rect (at 0 0 90) (size 1.7 1.7) (drill 1) (layers "*.Cu" "*.Mask")
      (net 44 "/PB0(U1RX)"))
    (pad "2" thru_hole oval (at 0 2.54 90) (size 1.7 1.7) (drill 1) (layers "*.Cu" "*.Mask")
      (net 45 "/PB1(U1TX)"))
    (model "${KISYS3DMOD}/Socket_Strips.3dshapes/Socket_Strip_Straight_1x02_Pitch2.54mm.wrl"
      (offset (xyz 0 -1.269999981 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 270))
    )
  )
  (footprint "Resistors_SMD:R_0805_HandSoldering" (layer "F.Cu")
    (at 123.063 90.805)
    (descr "Resistor SMD 0805, hand soldering")
    (tags "resistor 0805")
    (attr smd)
    (fp_text reference "R5" (at 0 1.27) (layer "F.SilkS"))
    (fp_text value "R" (at 0 1.27) (layer "F.Fab") hide)
    (fp_text user "${REFERENCE}" (at 0 1.27) (layer "F.Fab"))
    (pad "1" smd rect (at -1.35 0) (size 1.5 1.3) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 46 "/USB_ID"))
    (pad "2" smd rect (at 1.35 0) (size 1.5 1.3) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 44 "/PB0(U1RX)"))
    (model "${KISYS3DMOD}/Resistors_SMD.3dshapes/R_0805.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Resistors_SMD:R_0805_HandSoldering" (layer "F.Cu")
    (at 123.1265 85.09)
    (descr "Resistor SMD 0805, hand soldering")
    (tags "resistor 0805")
    (attr smd)
    (fp_text reference "R6" (at 0 -1.27) (layer "F.SilkS"))
    (fp_text value "R" (at -0.0635 -1.27) (layer "F.Fab") hide)
    (fp_text user "${REFERENCE}" (at 0 -1.27) (layer "F.Fab"))
    (pad "1" smd rect (at -1.35 0) (size 1.5 1.3) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 5 "+5V"))
    (pad "2" smd rect (at 1.35 0) (size 1.5 1.3) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 45 "/PB1(U1TX)"))
    (model "${KISYS3DMOD}/Resistors_SMD.3dshapes/R_0805.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Capacitors_SMD:C_0603" (layer "F.Cu")
    (at 152.565782 88.81035 90)
    (descr "Capacitor SMD 0603, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 0603")
    (attr smd)
    (fp_text reference "C1" (at 0 -1.5 90) (layer "F.SilkS"))
    (fp_text value "24pF" (at -2.12165 -0.038782 180) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 -1.5 270) (layer "F.Fab"))
    (pad "1" smd rect (at -0.75 0 90) (size 0.8 0.75) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 66 "/XOSC0"))
    (pad "2" smd rect (at 0.75 0 90) (size 0.8 0.75) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 1 "/XOSC_GND"))
    (model "Capacitors_SMD.3dshapes/C_0603.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Capacitors_SMD:C_0603" (layer "F.Cu")
    (at 152.565782 86.27035 90)
    (descr "Capacitor SMD 0603, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 0603")
    (attr smd)
    (fp_text reference "C2" (at 0 -1.5 90) (layer "F.SilkS"))
    (fp_text value "24pF" (at 2.19635 -0.038782 180) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 -1.5 270) (layer "F.Fab"))
    (pad "1" smd rect (at -0.75 0 90) (size 0.8 0.75) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 1 "/XOSC_GND"))
    (pad "2" smd rect (at 0.75 0 90) (size 0.8 0.75) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 67 "/XOSC1"))
    (model "Capacitors_SMD.3dshapes/C_0603.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Capacitors_SMD:C_0603" (layer "F.Cu")
    (at 144.145 87.63)
    (descr "Capacitor SMD 0603, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 0603")
    (attr smd)
    (fp_text reference "C3" (at 0 1.27) (layer "F.SilkS"))
    (fp_text value "10pF" (at 0 -1.143) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 1.27) (layer "F.Fab"))
    (pad "1" smd rect (at -0.75 0) (size 0.8 0.75) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 68 "/OCS0"))
    (pad "2" smd rect (at 0.75 0) (size 0.8 0.75) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "GNDREF"))
    (model "Capacitors_SMD.3dshapes/C_0603.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Capacitors_SMD:C_0603" (layer "F.Cu")
    (at 140.081 87.63 180)
    (descr "Capacitor SMD 0603, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 0603")
    (attr smd)
    (fp_text reference "C4" (at 0 -1.27 180) (layer "F.SilkS"))
    (fp_text value "10pF" (at 0 1.143 180) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 -1.27 180) (layer "F.Fab"))
    (pad "1" smd rect (at -0.75 0 180) (size 0.8 0.75) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 69 "/OCS1"))
    (pad "2" smd rect (at 0.75 0 180) (size 0.8 0.75) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "GNDREF"))
    (model "Capacitors_SMD.3dshapes/C_0603.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Capacitors_SMD:C_0603" (layer "F.Cu")
    (at 160.528 100.838 -90)
    (descr "Capacitor SMD 0603, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 0603")
    (attr smd)
    (fp_text reference "C5" (at -2.413 0 -90) (layer "F.SilkS"))
    (fp_text value "0.1uF" (at 0 -1.016 -90) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at -2.413 0 -90) (layer "F.Fab"))
    (pad "1" smd rect (at -0.75 0 270) (size 0.8 0.75) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 3 "+3V3"))
    (pad "2" smd rect (at 0.75 0 270) (size 0.8 0.75) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "GNDREF"))
    (model "Capacitors_SMD.3dshapes/C_0603.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Capacitors_SMD:C_0805" (layer "F.Cu")
    (at 158.496 100.457 -90)
    (descr "Capacitor SMD 0805, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 0805")
    (attr smd)
    (fp_text reference "C6" (at -2.667 0 -90) (layer "F.SilkS"))
    (fp_text value "22.0uF" (at 3.683 0 -90) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at -2.667 0 -90) (layer "F.Fab"))
    (pad "1" smd rect (at -1 0 270) (size 1 1.25) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 3 "+3V3"))
    (pad "2" smd rect (at 1 0 270) (size 1 1.25) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "GNDREF"))
    (model "Capacitors_SMD.3dshapes/C_0805.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Capacitors_SMD:C_0603" (layer "F.Cu")
    (at 147.193 112.395)
    (descr "Capacitor SMD 0603, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 0603")
    (attr smd)
    (fp_text reference "C7" (at -2.54 0) (layer "F.SilkS"))
    (fp_text value "0.1uF" (at 0 1.143) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at -2.54 0) (layer "F.Fab"))
    (pad "1" smd rect (at -0.75 0) (size 0.8 0.75) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 3 "+3V3"))
    (pad "2" smd rect (at 0.75 0) (size 0.8 0.75) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "GNDREF"))
    (model "Capacitors_SMD.3dshapes/C_0603.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Capacitors_SMD:C_0805" (layer "F.Cu")
    (at 147.336 110.236)
    (descr "Capacitor SMD 0805, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 0805")
    (attr smd)
    (fp_text reference "C8" (at -2.683 0) (layer "F.SilkS"))
    (fp_text value "22.0uF" (at 0 -1.397) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at -2.683 0) (layer "F.Fab"))
    (pad "1" smd rect (at -1 0) (size 1 1.25) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 3 "+3V3"))
    (pad "2" smd rect (at 1 0) (size 1 1.25) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "GNDREF"))
    (model "Capacitors_SMD.3dshapes/C_0805.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Capacitors_SMD:C_0603" (layer "F.Cu")
    (at 147.84 87.63 180)
    (descr "Capacitor SMD 0603, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 0603")
    (attr smd)
    (fp_text reference "C9" (at 0.012 1.27 180) (layer "F.SilkS"))
    (fp_text value "0.1uF" (at -2.02 0 270) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0.012 1.27 180) (layer "F.Fab"))
    (pad "1" smd rect (at -0.75 0 180) (size 0.8 0.75) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 3 "+3V3"))
    (pad "2" smd rect (at 0.75 0 180) (size 0.8 0.75) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "GNDREF"))
    (model "Capacitors_SMD.3dshapes/C_0603.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Capacitors_SMD:C_0805" (layer "F.Cu")
    (at 147.447 89.535 180)
    (descr "Capacitor SMD 0805, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 0805")
    (attr smd)
    (fp_text reference "C10" (at 0 -1.5 180) (layer "F.SilkS"))
    (fp_text value "22.0uF" (at 0 -1.27 180) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 -1.5 180) (layer "F.Fab"))
    (pad "1" smd rect (at -1 0 180) (size 1 1.25) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 3 "+3V3"))
    (pad "2" smd rect (at 1 0 180) (size 1 1.25) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "GNDREF"))
    (model "Capacitors_SMD.3dshapes/C_0805.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Capacitors_SMD:C_0603" (layer "F.Cu")
    (at 154.178 100.711 90)
    (descr "Capacitor SMD 0603, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 0603")
    (attr smd)
    (fp_text reference "C12" (at 2.54 0 90) (layer "F.SilkS"))
    (fp_text value "2.2uF" (at -3.048 0 90) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 2.54 0 90) (layer "F.Fab"))
    (pad "1" smd rect (at -0.75 0 90) (size 0.8 0.75) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 49 "/VDDC"))
    (pad "2" smd rect (at 0.75 0 90) (size 0.8 0.75) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "GNDREF"))
    (model "Capacitors_SMD.3dshapes/C_0603.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Capacitors_SMD:C_0603" (layer "F.Cu")
    (at 155.702 100.711 90)
    (descr "Capacitor SMD 0603, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 0603")
    (attr smd)
    (fp_text reference "C13" (at 2.54 0 90) (layer "F.SilkS"))
    (fp_text value "1.0uF" (at -3.048 0 90) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 2.54 0 90) (layer "F.Fab"))
    (pad "1" smd rect (at -0.75 0 90) (size 0.8 0.75) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 49 "/VDDC"))
    (pad "2" smd rect (at 0.75 0 90) (size 0.8 0.75) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "GNDREF"))
    (model "Capacitors_SMD.3dshapes/C_0603.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Capacitors_SMD:C_0603" (layer "F.Cu")
    (at 133.858 102.235 180)
    (descr "Capacitor SMD 0603, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 0603")
    (attr smd)
    (fp_text reference "C14" (at 0 -1.5 180) (layer "F.SilkS"))
    (fp_text value "0.1uF" (at 0 1.143 180) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 -1.5 180) (layer "F.Fab"))
    (pad "1" smd rect (at -0.75 0 180) (size 0.8 0.75) (layers "F.Cu" "F.Paste" "F.Mask")
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    (pad "2" smd rect (at 0.75 0 180) (size 0.8 0.75) (layers "F.Cu" "F.Paste" "F.Mask")
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      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Capacitors_SMD:C_0603" (layer "F.Cu")
    (at 132.207 98.425 -90)
    (descr "Capacitor SMD 0603, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 0603")
    (attr smd)
    (fp_text reference "C15" (at 0 -1.27 -90) (layer "F.SilkS"))
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    (pad "1" smd rect (at -0.75 0 270) (size 0.8 0.75) (layers "F.Cu" "F.Paste" "F.Mask")
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    (pad "2" smd rect (at 0.75 0 270) (size 0.8 0.75) (layers "F.Cu" "F.Paste" "F.Mask")
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      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Capacitors_SMD:C_0805" (layer "F.Cu")
    (at 135.128 98.425 -90)
    (descr "Capacitor SMD 0805, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 0805")
    (attr smd)
    (fp_text reference "C16" (at 0 -1.524 -90) (layer "F.SilkS"))
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    (pad "2" smd rect (at 1 0 270) (size 1 1.25) (layers "F.Cu" "F.Paste" "F.Mask")
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      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Capacitors_Tantalum_SMD:CP_Tantalum_Case-C_EIA-6032-28_Hand" (layer "F.Cu")
    (at 127.635 115.062 -90)
    (descr "Tantalum capacitor, Case C, EIA 6032-28, 6.0x3.2x2.5mm, Hand soldering footprint")
    (tags "capacitor tantalum smd")
    (attr smd)
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    (pad "2" smd rect (at 3.125 0 270) (size 3.75 2.5) (layers "F.Cu" "F.Paste" "F.Mask")
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      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
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    (descr "Capacitor SMD 0805, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 0805")
    (attr smd)
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      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
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  )
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      (rotate (xyz 0 0 0))
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      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
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      (net 36 "/PC6(U3RX)"))
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  (gr_text "Quick Specs\n-------------------\n5 mil minimum trace width\n5 mil minimum trace spacing\n10 mil minimum drill\n4 mil annular ring\nPCB thickness of 1.6mm (.063”)\n1oz copper on both sides (1.4mil,35um)\n0.5oz copper on internal layers (0.7mil, 17.5um)\n\n\n4 Layer Stackup\n\nThe current 4 layer board stackup is as follows:\n\nThickness	Layer	Tolerance\n1 mil	solder resist	+/-0.2mil\n1.4 mil	1 oz copper	 \n6.7 mil	FR408 prepreg	+/-.67mil\n0.7 mil	0.5 oz copper	 \n47 mil	FR408 core	+/-4.7mil\n0.7 mil	0.5 oz copper	 \n6.7 mil	FR408 prepreg	+/-.67mil\n1.4 mil	1 oz copper	 \n1 mil	solder resist	+/-0.2mil\nThe substrate for both the core and prepreg is FR408, with a dielectric constant of 3.66 at 1GHz, and is compatible with a lead free process. The boards themselves are also lead free and RoHS compliant.\n\nDetailed Specs\n-------------------\nENIG (gold) finish for superior soldering and environmental resistance.\nSolder resist and silkscreen on both sides.\nMinimum 15 mil keepout distance from traces to the board edge.\nPCB substrate is FR408 (180Tg).\nPCB substrate is compatible with a lead-free process.\nThe boards themselves are also lead free and RoHS compliant.\nPCB Substrate dielectric constant of 3.66 at 1GHz\nMinimum 4 mil soldermask web.\nMaximum soldermask expansion is 2.5mil.\nMinimum 100 mil width on internal cutouts. See our Slots page for further information.\nManufactured in the United States.\nCastellations are allowed, but not officially supported.\nWe do not support blind or buried vias.\nNon-plated slots wider than 100 mil are allowed, but not officially supported.\nPlated slots and smaller slots are possible, but not officially supported. See our Slots page for more.\n" (at 15.113 42.291) (layer "Dwgs.User"))
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