******************************************************************************
* @file    readme.txt
* @author  MCD Application Team
* @version V1.0
* @date    17-January-2017  
* @brief   32F413DISCOVERY Schematics files package
******************************************************************************
* COPYRIGHT(c) 2017 STMicroelectronics
*
* The Open Platform License Agreement (“Agreement”) is a binding legal contract
* between you ("You") and STMicroelectronics International N.V. (“ST”), a
* company incorporated under the laws of the Netherlands acting for the purpose
* of this Agreement through its Swiss branch 39, Chemin du Champ des Filles,
* 1228 Plan-les-Ouates, Geneva, Switzerland.
*
* By using the enclosed reference designs, schematics, PC board layouts, and
* documentation, in hardcopy or CAD tool file format (collectively, the
* “Reference Material”), You are agreeing to be bound by the terms and
* conditions of this Agreement. Do not use the Reference Material until You
* have read and agreed to this Agreement terms and conditions. The use of
* the Reference Material automatically implies the acceptance of the Agreement
* terms and conditions.
*
* The complete Open Platform License Agreement can be found on www.st.com/opla.
******************************************************************************

========================
* V1.0 - 17-January-2017
========================
* V2.0 - 19-May-2017
========================

******************************************************************************
* History
* V1.0	21-December-2016	Release MB1274D + MB1299B
* V2.0	19-May-2017		New release MB1274E + MB1299B-02     
******************************************************************************
* update for revision E
* - Replace R70 from 100K to 10K
* - Moved CN10 down to 2mm for LCD assembly
* - Update U21 footprint 
*- Update CN1 µSD connector footprint to support new reference with 
*positionning holes.
*
* update for MB1299 revision B02
* - update connector to support ribbon cable
******************************************************************************  

******************* (C) COPYRIGHT 2017 STMicroelectronics *****END OF FILE